n i chia st s-da1- 2954c nichia corporation specifications for white led NSSW157DT pb-f r e e r e f l o w so lder ing a ppli c at io n b u ilt -i n e s d p r ot ec ti on d e vi c e r o hs co mp lia nt http://
n i chia st s-da1- 2954c 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit forward current i f 150 ma pulse forward current i fp 200 ma allowable reverse current i r 85 ma power dissipation p d 510 mw operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * abs o l u te maxi mum r a t i ngs at t s =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ max unit forward voltage v f i f =80ma 3.0 - v luminous flux v i f =80ma 31.5 - lm luminous intensity i v i f =80ma 10.3 - cd x - i f =80ma 0.290 - - chroma ticit y c oordinate y - i f =80ma 0.275 - - thermal resistance r js - 20 28 c/w * char acteristics at t s =25c . * lum i nous f l ux v a l u e as p e r cie 127: 200 7 s t andard . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart . * r js is th ermal r e si sta n ce from juncti o n to t s measur in g point.
n i chia st s-da1- 2954c 2 ranks item rank min max unit forward voltage - 2. 7 3. 4 v p11d22 33. 0 36.0 p11d21 30. 3 33.0 p10d22 27. 8 30.3 luminous flux p10d21 25. 5 27. 8 lm color r a nks r a nk bt 04 rank bt05 x 0. 3000 0. 3000 0. 3050 0. 3050 x 0. 2950 0. 2950 0. 3000 0.3000 y 0. 2934 0. 3034 0. 3126 0. 3026 y 0. 2842 0. 2942 0. 3034 0.2934 r a nk bt 06 rank bt07 x 0. 2900 0. 2900 0. 2950 0. 2950 x 0. 2850 0. 2850 0. 2900 0.2900 y 0. 2750 0. 2850 0. 2942 0. 2842 y 0. 2658 0. 2758 0. 2850 0.2750 r a nk bt 08 rank bt09 x 0. 2800 0. 2800 0. 2850 0. 2850 x 0. 2750 0. 2750 0. 2800 0.2800 y 0. 2566 0. 2666 0. 2758 0. 2658 y 0. 2474 0. 2574 0. 2666 0.2566 r a nk bt 10 rank bt11 x 0. 2700 0. 2700 0. 2750 0. 2750 x 0. 2650 0. 2650 0. 2700 0.2700 y 0. 2382 0. 2482 0. 2574 0. 2474 y 0. 2290 0. 2390 0. 2482 0.2382 r a nk bt 12 rank bt24 x 0. 2600 0. 2600 0. 2650 0. 2650 x 0. 3000 0. 3000 0. 3050 0.3050 y 0. 2198 0. 2298 0. 2390 0. 2290 y 0. 2834 0. 2934 0. 3026 0.2926 r a nk bt 25 rank bt26 x 0. 2950 0. 2950 0. 3000 0. 3000 x 0. 2900 0. 2900 0. 2950 0.2950 y 0. 2742 0. 2842 0. 2934 0. 2834 y 0. 2650 0. 2750 0. 2842 0.2742 r a nk bt 27 rank bt28 x 0. 2850 0. 2850 0. 2900 0. 2900 x 0. 2800 0. 2800 0. 2850 0.2850 y 0. 2558 0. 2658 0. 2750 0. 2650 y 0. 2466 0. 2566 0. 2658 0.2558 r a nk bt 29 rank bt30 x 0. 2750 0. 2750 0. 2800 0. 2800 x 0. 2700 0. 2700 0. 2750 0.2750 y 0. 2374 0. 2474 0. 2566 0. 2466 y 0. 2282 0. 2382 0. 2474 0.2374 r a nk bt 31 rank bt32 x 0. 2650 0. 2650 0. 2700 0. 2700 x 0. 2600 0. 2600 0. 2650 0.2650 y 0. 2190 0. 2290 0. 2382 0. 2282 y 0. 2098 0. 2198 0. 2290 0.2190 * r a nking at t s =25c. * f o rw ard v o l t age t o le r a nce: 0. 05v * luminous flux t o ler a nc e: 5% * chrom a t i ci t y coordi nate t ol e r a nce : 0 . 003 * led s from the abo v e r a nk s wil l b e shi p p e d. the r a nk combinat ion r a t i o per sh ipmen t will be d e cided by nichia .
n i chia st s-da1- 2954c 3 chroma ticity d i agram bt04 bt 0 5 bt 0 6 bt 0 7 bt 0 8 bt 0 9 bt 1 0 bt11 bt12 bt 2 4 bt 2 5 bt26 bt27 bt 2 8 bt 2 9 bt 3 0 bt 3 1 bt32 0.15 0.20 0.25 0.30 0.35 0.20 0.25 0.3 0 0 .35 0.40 x y
n i chia st s-da1- 2954c 4 outline dimensions sts- da7- 5321a n x s w 157d no. ( g unit : mm) t h is produc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g unit : mm, to le r a n c e : 0 . 2 ) o pro t ecti on dev i c e ka dimensions do not include mold flash. ? ? ? ? * 0.76 0.26 2.6 0.86 anode cathode 0.52 (1) (2.6) 1.4 3 ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0 . 0074g( t y p )
n i chia st s-da1- 2954c 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing cond it ion temperature 350c max soldering time 3sec max r e c o m m e n d e d s o l d e r i n g p a d p a t t e r n r e com m en ded m e ta l solder s t en ci l apertur e ( g unit: mm) 3.04 3.76 0.07 0.89 0.52 0.93 0.76 0.86 1.55 0.26 2.8 4 * thi s led is desi gned to be refl ow so l d ered on to a pc b . if dip soldered , nich ia can n ot guar antee its r e liabilit y . * r e flow so ld ering mu st not be performed more than twic e. han d sold ering mu st not b e performed more than o n ce. * a v oid r apid cooling. r a mp down th e temp er ature gr adua lly from th e peak temper ature. * nitrogen ref l ow soldering is re co mmend e d. air flow sold ering cond it ion s can cause optical d e gr adation, caused by h e at and / or atmospher e . * since the si l i con e us ed i n t h e en cap s ul at i n g res i n is sof t , do not pre ss on the en caps ulan t re si n. pressure ca n cau s e n i ck s, chip -ou t s , en c apsu l an t de la mi na tion an d deformation , an d wire break s , decrea sing reliabilit y . * r e pairing should not be d o ne after th e l e ds ha v e been solder ed. wh en repair i ng is u n a v oidable, a double-h ead solder ing ir on shou ld be u s ed. it should b e confir med b e forehand wh et h e r th e char ac te ri st i cs of th e l e d s wi ll or w i l l not be da maged by repairing . * when sold ering, do not ap ply str e s s to t h e le d whi l e th e le d is hot . * when using a pick and p l a c e mach in e, ch oose an appro p riat e nozzle f o r this product. usin g a p i ck -and-p lace nozz le with a smaller dia m eter t h an th e s i ze of t h e le d's e m it ti ng surfac e will cause damage to th e emitting surface and may als o caus e the le d not to i l l u m i nate . * the reco mmen ded so lder ing pad pa tter n is d e sign ed for attachmen t of the le d w i thout prob lems. when precise mou n ting a c cur a cy is re qu ired, such a s h i gh-densit y mo unting , en sur e tha t th e siz e a n d shap e of th e pad are suitab le for the circu i t design. * consider fa ctors such as t h e reflow sold e r ing t e m p er atu r e, ha nd sold er ing t e mper at ure, e t c . wh en c h oosi n g th e so l d er . * when fl ux is used, i t should be a ha log e n free flux . en su re tha t th e m a nufac tur i ng pr oces s i s not d e sign ed i n a ma nner where the f l ux wil l co me in conta c t w i t h t h e le ds . * make sure t h at t h er e are n o iss u e s wi th t h e t y pe and a m oun t of sold er that is b e ing used . * all of the electrod e pads ar e on th e back s id e of th is pro d uct; so lder connection s wi ll not be ab le to be seen nor co nfirmed by a normal visua l insp ection. when us in g the produ c t , ens u re th at th ere are no is su es with th e sol d er ing cond it io ns. 120sec max pre- hea t 180 t o 200c 260cmax 10sec max 60sec max above 220c 1 t o 5c per sec
n i chia st s-da1- 2954c 6 t a pe and reel dimensions sts- da 7 - 0071c nxxx157x ?` / ` tr a iler and l e ader to p co ver ta p e led ? ` 400mm ?` 160mm ? tr ai le r 160mm m i n ( e m pt y pocke t s) lo aded po ckets ? ? ` e m bo ss ed c a rr i e r t a pe ?? ` ?` f eed dir e ct ion lea d er with o u t t op co ver t ape 400mm mi n 100mm ? lea d er with to p cov e r ta p e 100mm min ( empt y po c k et ) no . ( g uni t : mm) 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? l abel 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0 .3 180 +0 -3 -0 1.5 +0.1 ` ??? tap e 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 1. 6 0 .1 0.2 0 . 0 5 3. 25 0.1 0.65 0. 1 -0 1 +0 . 1 cathod e r eel size: 5000pcs 1 `? 500 0 * th e t ape packin g met h o d c o mp lies w i t h j i s c 0806 (p ack aging of ele c troni c co mpo n e n ts o n co nt i nuous t apes ) . * jis c 0806 ? ?` ? ? ? w h en the tape i s re wo un d due to work i n terruptio n s , n o more t h an 10n sh ou ld b e app li ed t o the em bo ss ed c a rrier tape. t h e l eds m a y sti c k to the top c o ver tape. * g? I ? ?? ??` ? `? ? ? ??`? (1 0 n ) ? led ` ` ? N ? ?
n i chia st s-da1- 2954c 7 p a ckaging - t a pe & reel nichia led sts-da7-0006c n x xxxxxx ? label la b e l no . reel ` ?` sea l moistu re-proo f ba g ? ? rohs nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty . ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ` ? ` desic c ant s ? m o is tu re -pr o of ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c or r u ga ted pa rti t i on s . ? K ? ` ? ?` ? ? ? y ? ? * ? \ H? y ? B ? ? y * ? Q H n ? u? p ? ? ? ? * using the o r iginal package ma ter i al o r e q u i vale n t in t r an s i t is r e c o mme n d e d . do no t expos e to water. t h e bo x i s no t water-res i s t ant. do no t drop or expos e t h e bo x to extern al fo rces a s it ma y damage the products. pr o d ucts sh ipp e d o n tape a n d r eel a r e p a ck ed in a moistu re-proo f bag. t h ey a r e shipp e d in card bo ard bo xes to p r otect th em fro m exte rnal f orce s during trans p o r ta tio n . * u ? ?` ? n ? g o ?` y ? if n ot provide d , it w ill n o t be in d i cat e d on t h e l a b e l . * ****** is t h e c u st omer part number . O * ******* ? fo r d e t a i l s, see "lot number ing code" in t h is d o c u me n t . * ?? ? ? ?? t h e l abel does no t have the rank f i el d fo r un-ranke d produc ts. * ? ? ?
n i chia st s-da1- 2954c 8 l o t numbering c o de lot numb er is presented by using th e following alpha n u m er ic cod e . ymxxxx - r r r y - y e a r year y 2013 d 2014 e 2015 f 2016 g 2017 h 2018 i m - m o n t h month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -n ichia's product n u m b er rrr - r ank i ng by color c oordinat e s , r a nking by lu mi nous fl ux
n i chia st s-da1- 2954c 9 dera ting characteristics n ssw157d ? n o. sts- d a 7- 5309 derating1 0 50 100 150 200 250 300 0 2 04 06 08 0 1 0 0 1 2 0 (75, 150) (100, 66.0) der a ting2 0 50 100 150 200 250 300 0 20 40 60 80 100 120 (100, 150) duty 10 100 1000 1 10 100 150 200 S allowable forward current ( ma ) ????(`?)-S solder temperat ure(cat h ode side) vs allowable forward current ??-S ambient temperat ure vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ????(`?) solder temperature(cathode side)( c) ?? ambient temperature( c ) ?` ` duty rati o(%) ?`?`-S d u ty rati o v s allowable forward current 92c / w ? ja r = t a = 25c
n i chia st s-da1- 2954c 10 optical characteristics n ssw157d ? n o . sts- d a 7- 5310b spectrum 0. 0 0.2 0. 4 0. 6 0. 8 1. 0 350 400 450 500 550 600 650 700 750 ? rel a ti ve il l u mi nance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 k??? spect r u m k? relative emission intensity(a.u.) L wa velength(nm) ? d i rectivity ? radiation angle 1 0 .5 0 0 .5 1 a 80m a i f = t = 25c 80ma i fp = t a = 25c * ??? al l characteri sti cs shown are for refe rence only and are not guaranteed.
n i chia st s-da1- 2954c 11 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n ssw157d ? n o . sts- d a 7- 5311a tavf 2. 0 2. 5 3. 0 3. 5 4. 0 -60 - 40 -20 0 20 40 60 80 100 120 taiv 0. 6 0. 8 1. 0 1. 2 1. 4 -60 - 40 -20 0 20 40 60 80 100 120 vfif 10 100 1000 2. 0 2. 5 3. 0 3. 5 4. 0 80 200 relative luminous flux(a.u.) ??- ambient temperat ure vs relat i ve l u m in ou s f l u x forward current(ma) ifiv 0. 0 0. 5 1. 0 1. 5 2. 0 2. 5 3. 0 0 5 0 100 150 200 250 relative luminous flux(a.u.) - forward current vs relat i ve l u m in ou s f l u x forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperat ure vs forward voltage ?R forward vol t a g e ( v ) ?R forward voltage(v) ?? ambi ent tem p erature ( c ) ?? ambient temperature(c) t a = 25c * ??? al l characteri sti cs shown are for refe rence only and are not guaranteed. t a = 25c i fp = 80ma i fp = 80ma
n i chia st s-da1- 2954c 12 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n ssw157d ? n o . sts- d a 7- 5312a taxy 0.26 0. 27 0. 28 0. 29 0. 30 0. 27 0. 28 0. 29 0. 30 0. 31 -40c 0c 25c 100c x ifxy 0.26 0. 27 0. 28 0. 29 0. 30 0. 27 0. 28 0. 29 0. 30 0. 31 10ma 20ma 80ma 150ma 200m a x y y 80m a i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chro mati ci ty co o r di nate t a = 25c * ??? all characteristics shown are for refe rence only and are not guaranteed.
n i chia st s-da1- 2954c 13 reliability (1) t e s t s a n d r e sults te s t reference standard t e st co ndi t io ns te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (r ef low sol d eri n g) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2refl o ws , prec ondit i o n : 3 0 c, 70% r h , 168hr #1 0/22 solderability (r ef low sol d eri n g) j e it a ed- 4701 303 30 3a t sl d =2455c, 5s ec, lead- fr ee sold er( s n- 3. 0ag - 0.5cu) #2 0/ 22 ther mal s hock j e it a ed- 4701 300 30 7 - 40c t o 100c, 1mi n dwell , 10sec tr an sfer , prec ondit i o n : 3 0 c, 70% r h , 168hr 100c y c l e s #1 0/ 22 t e mper a t ure c y cle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 22 mois tur e r e si st ance (cycl i c ) j e it a ed- 4701 200 20 3 25c~65c~-10c, 90% r h , 24hr per cy cle 10c y c l e s #1 0/ 22 high t e mp er ature stor age j e it a ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 22 t e mper a t ure h u m i di t y stor age j e it a ed- 4701 100 10 3 t a =60c, r h =90% 1000hours #1 0/ 22 low t e mp er atu r e stor age j e it a ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 22 r oom t e mper a t ure operating life condi t ion 1 t a =25c, i f =80m a t e st board : see n o tes b e low 1000hours #1 0/ 22 r oom t e mper a t ure operating life condi t ion 2 t a =25c, i f =150m a t e st board : see n o tes b e low 500hours #1 0/ 22 high t e mp er ature oper ating lif e t a =100c, i f =65m a t e st board : see n o tes b e low 1000hours #1 0/ 22 t e mper a t ure h u m i di t y oper ating lif e 60c, r h =90 % , i f =100m a t e st board : see n o tes b e low 500hours #1 0/ 22 low t e mp er atu r e oper ating lif e t a =- 40c, i f =80m a t e st board : see n o tes b e low 1000hours #1 0/ 22 vibr ation j e it a ed- 4701 400 40 3 200m / s 2 , 100 ~2000~100hz , 4 c ycle s, 4 m i n , each x, y , z 48m i n ut es #1 0/ 22 ele c tro s ta ti c d i scharg e s j e it a ed- 4701 300 30 4 hbm, 2kv , 1. 5 k ? , 100pf , 3pul ses, alterna t ely positi v e or nega tive #1 0/ 22 solder ing join t shear streng th j e it a ed - 4702b 002 3 5n , 101s ec #1 0/ 22 no tes: 1) t e st board: fr 4 board t h ic kness = 1.6m m, c o pper la y e r t h ic kness=0. 07m m, r ja 92c/ w 2) measu r ements are p e rformed af ter allo w i ng th e le ds to ret u rn to room te mper a t ure . ( 2 ) f a ilu re c r it eria cr iteria # items conditions failure criteria f orward voltage(v f ) i f =80ma >u.s.l.1.1 #1 lumino us f l ux ( v ) i f =80m a n i chia st s-da1- 2954c 14 ca u t ion s (1) stor age conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or equiv a lent . se e ipc/j e d e c std - 020 for m o i s t u re- s ens i t i v i t y det a il s. absorbed moisture in le d packages can v aporize and expand during soldering, w h ich can ca use in te rface de lam i na tion and result in optical p e rforman c e degr ad ation . prod ucts are pack e d in moisture-proof alu m inu m bag s to min i mize moistur e abso r ptio n d u ring tr ansporta tion a n d stor age. in c l u d e d s ilic a ge l de si cc ant s ch an ge from bl u e t o re d i f m ois tu re h ad pe n e t r at e d bags. after openin g the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th silic a gel de sicca nt s in a hermetically sea l ed co nta i ner , prefer ably th e orig in al mo isture -pr oof bags for stor age. after t h e ?p eriod aft e r op eni n g? s t or age time h a s be en exceed ed or s i l i ca ge l de sicca nts ar e no lo ng er blu e , the products should be b a k ed. baking should only be d one once. customer i s advi s ed to k e ep the leds in a n ai rti g ht co nt ainer w h e n not in u s e. expos u re to a corrosi v e en v i ronment may cause t h e pla t ed me ta l part s of the p r oduct to tarn i s h, w h i c h co ul d adverse ly affect so ld ering a n d optica l char acter i sti cs . it is also recommended to return th e le d s to th e orig inal moistur e p r oof bags and resea l . after assembly and dur i ng use, si l v er p l ating can b e affected by the corrosi v e ga ses emitted by componen ts an d mater i als in close pro x imit y of the l e ds with in an end produ c t, a n d th e gas es e n ter i ng in to th e produc t from the exter n al a t mo spher e . the above should b e take n into cons ider a t ion w he n des i gning . r e sin mat e r i al s, in part i cu l a r , may co nta i n sub s ta nc e s whi c h ca n affe ct s i lver pla t i n g, su ch a s halo gen. do not use s u lfur- c on tai n i n g ma teri als i n commercial products. some mater i als, su ch a s seals and adh esives, ma y co nta i n su lfur . the extre m ely corroded or conta m inat ed plating of le ds mig h t cause a n open ci rcuit. si li co ne rubb er i s recomm end e d as a mater i al for sea l s. bear in mi nd , t h e use of s i l i co ne s may l e ad to si li co ne con t a m i n at ion of e l e c tri c a l con t ac ts inside th e p r oduct s , caus e d by lo w mol e c u lar we igh t vol a ti le si loxane . t o prevent w a ter cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midi t y fl uc tua t ions for th e s t or age condi t io ns. do not stor e th e le ds in a dus t y en viron m en t . d o not expo se the leds to di rect s u n lig ht and/or an e n vironme n t w h er e th e te mp er at ure i s hi gher t h an normal room temp er atur e. (2) di recti o ns for use when de sig n ing a cir c u i t , t h e c u rren t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ating a t a co nstan t cu rrent p e r le d is reco mmen ded. in case of o p er ating at a c onsta nt vo ltag e, c i rcu i t b is r e commende d . if the leds are oper ated w i th con s ta nt voltag e us ing c i r c ui t a, th e curr ent throug h t h e leds may v a ry due to t h e v a riat ion in f orw ard v oltage ch ar acteristics of the leds. (a) ... (b) .. . this product sho u l d b e oper ated using forw ard curre n t . ens u re t h at th e produc t i s no t subj ec ted to either forw a r d or reverse voltag e wh il e i t is no t i n us e. i n parti c u l ar , su bject i ng it to c o nti nuou s reve rse volt age may cause migr a t io n , wh i c h may cau s e damage to t h e led d i e . when used i n d i sp la ys tha t are no t used for a l o ng tim e , the m a i n po wer supp l y sho u l d be switched off for safet y . it is recom m en ded to ope r ate the le ds at a current gr eater t h an 10% of the sorting current to stabilize the le d char acter i stic s. ens u re t h at exces s ive volta g es s u c h as l i g h tn ing surge s are not app l i e d to th e le ds . f o r outdoor use , ne ce ssary mea s ure s sho u ld be taken to prevent wa ter , moi s tur e and sal t air da mag e .
n i chia st s-da1- 2954c 15 (3) handl i n g precau ti ons do not hand le t h e l e ds wi t h bare hand s a s it w i ll contam ina t e t h e l ed s u rface and may affect t h e op ti cal char ac ter i st ic s: it mig h t cau s e t h e le d to be deform ed a n d/or t h e w i re to break, w h i c h will c a us e t h e le d not to il l u m i na te . when ha ndl i ng t h e produ c t wi th t w ee zer s , be carefu l n o t to apply exc e ss ive forc e to the r e s i n. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. dropping th e produc t ma y cause damage. do not sta c k asse mb led p c bs tog e t h er . f a il ure to comp l y can cau s e th e res i n port io n of the produ c t to be cut, ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, l e ad ing to catas t roph ic f a il ures . (4) desi gn consi d er ati o n pcb warpag e after moun ti ng th e produc t s on to a pc b c a n cau s e the p a ckage to br ea k. the led s h ould be p l ac ed in a w a y to m i ni mize t h e s t re ss on the l e d s due to pc b bo w and twis t. the positi o n and ori e nta t i o n of the leds affect how much m e cha n i c al stre ss i s exerte d on the led s plac ed near th e score l i n e s . the led s h ould be p l ac ed in a w a y to mi ni mize t h e s t re ss on the l e d s due to board f l ex ing. board separ a tion mu st b e performed us in g spec ia l j i g s , no t u s in g hand s. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or surg e voltag e. es d ca n damag e a di e and i t s re l i ab il i t y . when handl i ng t h e produ c ts , th e fol l owi n g mea s ure s ag ains t e l e c tro s t a ti c di sch arge are stron g ly re com m e n ded : e l i m i n a t i n g t h e c h a r g e grounded wri s t str a p , esd footw e ar , clothes, a n d fl oo rs grounded workstat i on equi pm en t and tools esd tabl e/s h e l f ma t ma de o f co ndu c t i v e ma ter i al s ens u r e t h at to o l s (e .g. so ld er ing ir o n s ) , j i gs and m a ch in es t h at ar e be i n g us ed are pr operly ground e d and that proper grounding tech niqu es ar e used in wo rk area s. f o r dev i c e s / equi pm en t tha t mou n t th e le ds , protectio n a g ain s t s u rge voltag es s h ou ld also be us ed. if tools or e q uip m e n t co nt ain i n s u la ti ng mat e ria l s su ch as gla ss or pla s t i c , t h e fol l o wi ng m e as u r es agai n s t el ec t r os t a ti c di sch arge are stron g ly re com m e n ded : diss ipat i n g sta t ic c h arg e wi th co nduc t i ve mat e ria l s preventi ng charg e gen e r a tion w i th m o is ture n e u t r a l i z i n g t h e c h a r g e w i t h i o n i z e r s th e cu st ome r i s advi se d to c h ec k if the leds are da ma ged by esd when performi ng th e c h ar acter i s t i cs in spe c t i on of th e le ds in t h e app l i c at ion. damage ca n be detected with a forw ard v o ltag e mea s u r eme n t or a l i g h t - up te st a t lo w curren t ( 1m a ) . esd da m a g e d led s m a y ha v e current fl o w at a l o w vo l t age o r no lo ng er il lu m i na te at a lo w cur r e nt . f a ilur e c r iter ia : v f <2.0 v at i f =0.5ma
n i chia st s-da1- 2954c 16 (6) t h ermal manageme nt proper th er mal manage m e nt is a n i m po r t an t when designing prod uc ts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a w a y that t h e l ed d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). drive curre nt s h oul d be d e ter m ined for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at from the pr oduct . the fol l owi n g equat i on s ca n be us ed to c a lcu l a t e the ju nct i on te mper a t ure of t h e pro d uct s . 1 ) t j =t a +r ja ? w 2 ) t j =t s +r js ? w * t j =led junc tio n te mp e r ature: c t a = a m b i e nt te mp e r a t ure : c t s =soldering te mper a t ure ( c at hode s i de) : c r ja =th e rm a l resi stance from juncti o n to am b i ent: c/w r js =therm a l resi stance from juncti o n to t s measuring point: c /w w = i n p u t p o w e r ( i f v f ): w ts p o in t (7) cl eani ng the leds shoul d no t be cl eaned w i th w a t e r , b e n z i n e , an d/ o r t h i n ne r . if r e quir ed, isopr o py l a l coho l (ip a ) s h oul d be use d . ot he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e ver i f i ed pr ior to u s e . in additio n , the use of c f c s su ch as freo n is hea v ily regula ted . when du st and/or dir t adh eres to th e le ds , soak a cloth with isoprop y l alco hol (ip a ), then squeeze i t b e fore wiping the led s . ul tr ason ic cl eani ng i s no t recom m e nded s i nc e i t ma y have adverse eff e ct s on t h e l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asoni c clea ni ng m u s t be use d , t h e c u sto m er is adv ised to mak e sure th e le ds w i ll not b e da ma ged prior to cleaning . (8) ey e saf e t y in 2006, t h e interna t i o nal el ec t r i c a l comm is si on (iec ) publi s hed iec 62471: 200 6 phot obi o l o gic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. howev e r , please b e advised that some co untr i es and regions ha v e ado pted stand a rds bas ed on t h e iec l a s e r safet y s t a n dard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e. most of n i chi a's leds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. hi gh - p owe r le ds , t h at em it li gh t con t ai ni ng blu e w a vel e ngth s, ma y be cla s sified as risk group 2. please pro c eed wi th cau t io n whe n view in g direc t ly an y leds driv en at high current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crease th e damage s to your eyes . view ing a f l ashing ligh t ma y cause ey e d i scomfort. w h e n in cor p or ati n g the l e d in to your pr oduct , please be careful to a v oid adv erse eff e cts on the hu man body caused by ligh t stimu l a t ion.
n i chia st s-da1- 2954c 17 (9) ot hers the le d s d e scr ibed in th is brochure ar e i n te nded to be used for ordin a ry e l ec t r oni c equ i pm en t ( s uch as offi ce eq uipm ent, commun i cat i ons equ i pm en t, mea s ure m e n t in str um e n t s and hou s eho l d applia nc es ). consult nichia's sales staf f in adv an ce fo r informa t io n on th e applica t ions in wh ich ex ceptiona l qua l it y and r e liab i l i t y ar e r e q u ir ed , par t i cu lar l y when the f a il ur e or malf u n c t ion of the le ds m a y dir e c t ly j e o par dize lif e or h e a l t h ( s u c h a s f o r a i r p la ne s , ae r o s p ac e, s u bm e r si bl e repeaters, nuc l e ar reactor co ntrol system , a u tom o bil e s, tr affic contr o l equi p m en t, l i fe s u pport sy s t e m s and safe ty devic e s ) . the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys i s of the le ds wi t h out ha v i ng pr i o r writt e n co ns ent from nich ia . when def e c t ive le ds are fou n d, t h e c u s t om er sha ll inf o r m ni ch ia dir e c t ly bef o r e di sas s e m bl ing or ana l y s is . the sp ecification s and app ear a nce of th is product ma y change w i thou t notice; nich ia doe s not guar an te e the cont en ts of thi s sp ec ifi c at i o n. bo th t h e c u sto m er a n d n i ch ia will agr e e on the of f i c i al s p ec if ic at ions of suppl ie d pr oduct s bef o r e th e volum e pr odu c t i on of a pr ogr a m begi ns .
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